Reliable grounding of your ESD flooring is imperative. While copper may start out being slightly more conductive than aluminum this conductivity is reduced drastically upon contact with today's conductive adhesives.
Chemical concentrates used to cure the conductive adhesive rapidly oxidize the copper. Over a period of several days the copper develops an easy to see green copper oxide insulative residue. This residue dramatically reduces conductivity. Over a period of a year this insulative copper oxide continues to "grow" in thickness changing the conductivity of the grounding foil to (in many cases) well over 2,000 ohms. In addition most copper foil tapes used for grounding esd floors are a mere .500 wide not providing optimum contact for long term conductivity.
United SCP's 2" wide High Purity chemical resistant aluminum foil ground grid tape is the ultimate mechanism when ground grids are required for your esd flooring materials. With highly oxidation resistance to conductive adhesive curing chemicals and excellent long term conductivity this innovative alloy is far superior to copper.
